Cita APA (7a ed.)

Nguyen, B. D., Steiner, J., Wellmann, P., & Sandfeld, S. (2024). Combining unsupervised and supervised learning in microscopy enables defect analysis of a full 4H-SiC wafer.

Cita Chicago Style (17a ed.)

Nguyen, Binh Duong, Johannes Steiner, Peter Wellmann, y Stefan Sandfeld. Combining Unsupervised and Supervised Learning in Microscopy Enables Defect Analysis of a Full 4H-SiC Wafer. 2024.

Cita MLA (9a ed.)

Nguyen, Binh Duong, et al. Combining Unsupervised and Supervised Learning in Microscopy Enables Defect Analysis of a Full 4H-SiC Wafer. 2024.