APA (7th ed.) Citation

Cuesta, D., Risco-Martín, J. L., Ayala, J. L., & Hidalgo, J. I. (2024). Thermal-Aware Floorplanner for 3D IC, including TSVs, Liquid Microchannels and Thermal Domains Optimization.

Chicago Style (17th ed.) Citation

Cuesta, David, José L. Risco-Martín, José L. Ayala, and J. Ignacio Hidalgo. Thermal-Aware Floorplanner for 3D IC, Including TSVs, Liquid Microchannels and Thermal Domains Optimization. 2024.

MLA (9th ed.) Citation

Cuesta, David, et al. Thermal-Aware Floorplanner for 3D IC, Including TSVs, Liquid Microchannels and Thermal Domains Optimization. 2024.