Cita APA (7a ed.)

Soulié, J., Sankaran, K., Pourtois, G., Swerts, J., Tőkei, Z., & Adelmann, C. (2024). Cu$_x$Al$_{1-x}$ films as Alternatives to Copper for Advanced Interconnect Metallization.

Cita Chicago Style (17a ed.)

Soulié, Jean-Philippe, Kiroubanand Sankaran, Geoffrey Pourtois, Johan Swerts, Zsolt Tőkei, y Christoph Adelmann. Cu$_x$Al$_{1-x}$ Films as Alternatives to Copper for Advanced Interconnect Metallization. 2024.

Cita MLA (9a ed.)

Soulié, Jean-Philippe, et al. Cu$_x$Al$_{1-x}$ Films as Alternatives to Copper for Advanced Interconnect Metallization. 2024.