Citazione Stile APA (7a Edizione)

Paradkar, A., Nicaise, P., Dakroury, K., Resare, F., & Wieczorek, W. (2024). Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer.

Citazione stile Chigago Style (17a edizione)

Paradkar, Achintya, Paul Nicaise, Karim Dakroury, Fabian Resare, e Witlef Wieczorek. Superconducting Flip-chip Devices Using Indium Microspheres on Au-passivated Nb or NbN as Under-bump Metallization Layer. 2024.

Citatione MLA (9a ed.)

Paradkar, Achintya, et al. Superconducting Flip-chip Devices Using Indium Microspheres on Au-passivated Nb or NbN as Under-bump Metallization Layer. 2024.