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Autores principales: Pamarty, Abhijit Pranav, Neuweiler, Robert, Do, Le Quyen, Johnson, Keaton, Sanchez, James J., Koli, Dinesh
Formato: Preprint
Publicado: 2024
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Acceso en línea:https://arxiv.org/abs/2409.12925
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_version_ 1866913508406329344
author Pamarty, Abhijit Pranav
Neuweiler, Robert
Do, Le Quyen
Johnson, Keaton
Sanchez, James J.
Koli, Dinesh
author_facet Pamarty, Abhijit Pranav
Neuweiler, Robert
Do, Le Quyen
Johnson, Keaton
Sanchez, James J.
Koli, Dinesh
contents Reliable predictions of the etch rate profile are desirable in semiconductor manufacturing to prevent etch rate target misses and yield rate excursions. Conventional methods for analyzing etch rate require extensive metrology, which adds considerable costs to manufacturing. We demonstrate a data-driven method to predict the etch rate profiles of a capacitively-coupled plasma RIE etcher from the tool's sensor data. The model employs a hybrid autoencoder-multiquadric interpolation-based approach, with the autoencoder being used to encode the features of the wafers' etch rate profiles into a latent space representation. The tool's sensor data is then used to construct interpolation maps for the latent space variables using multiquadric radial basis functions, which are then used to generate synthetic wafer etch rate profiles using the decoder. The accuracy of the model is determined using experimental data, and the errors are analyzed in interpolation and extrapolation.
format Preprint
id arxiv_https___arxiv_org_abs_2409_12925
institution arXiv
publishDate 2024
record_format arxiv
spellingShingle Data-driven surrogate model for etch rate profiles using sensor data from a reactive ion etcher
Pamarty, Abhijit Pranav
Neuweiler, Robert
Do, Le Quyen
Johnson, Keaton
Sanchez, James J.
Koli, Dinesh
Computational Engineering, Finance, and Science
Reliable predictions of the etch rate profile are desirable in semiconductor manufacturing to prevent etch rate target misses and yield rate excursions. Conventional methods for analyzing etch rate require extensive metrology, which adds considerable costs to manufacturing. We demonstrate a data-driven method to predict the etch rate profiles of a capacitively-coupled plasma RIE etcher from the tool's sensor data. The model employs a hybrid autoencoder-multiquadric interpolation-based approach, with the autoencoder being used to encode the features of the wafers' etch rate profiles into a latent space representation. The tool's sensor data is then used to construct interpolation maps for the latent space variables using multiquadric radial basis functions, which are then used to generate synthetic wafer etch rate profiles using the decoder. The accuracy of the model is determined using experimental data, and the errors are analyzed in interpolation and extrapolation.
title Data-driven surrogate model for etch rate profiles using sensor data from a reactive ion etcher
topic Computational Engineering, Finance, and Science
url https://arxiv.org/abs/2409.12925