Wu, H., Lu, H., Peng, W., Xu, Z., Chu, Y., Sun, J., . . . Huang, R. (2024). From Flip FET to Flip 3D Integration (F3D): Maximizing the Scaling Potential of Wafer Both Sides Beyond Conventional 3D Integration.
Citazione stile Chigago Style (17a edizione)Wu, Heng, et al. From Flip FET to Flip 3D Integration (F3D): Maximizing the Scaling Potential of Wafer Both Sides Beyond Conventional 3D Integration. 2024.
Citatione MLA (9a ed.)Wu, Heng, et al. From Flip FET to Flip 3D Integration (F3D): Maximizing the Scaling Potential of Wafer Both Sides Beyond Conventional 3D Integration. 2024.
Attenzione: Queste citazioni potrebbero non essere precise al 100%.