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From Flip FET to Flip 3D Integration (F3D): Maximizing the Scaling Potential of Wafer Both Sides Beyond Conventional 3D Integration

Fuente: arXiv

Salvato in:

Dettagli Bibliografici
Autori principali:	Wu, Heng, Lu, Haoran, Peng, Wanyue, Xu, Ziqiao, Chu, Yanbang, Sun, Jiacheng, Zhou, Falong, Wu, Jack, Zhang, Lijie, Bu, Weihai, Kang, Jin, Li, Ming, Lin, Yibo, Wang, Runsheng, Zhang, Xin, Huang, Ru
Natura:	Preprint
Pubblicazione:	2024
Soggetti:	Mesoscale and Nanoscale Physics
Accesso online:	Acceder al recurso
Tags:	Aggiungi Tag Nessun Tag, puoi essere il primo ad aggiungerne!!

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