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Bibliographic Details
Main Authors: Fa, Yuan, Piacentini, Agata, Macco, Bart, Kalisch, Holger, Heuken, Michael, Vescan, Andrei, Wang, Zhenxing, Lemme, Max C.
Format: Preprint
Published: 2024
Subjects:
Online Access:https://arxiv.org/abs/2412.08663
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Table of Contents:
  • Two-dimensional material (2DM)-based field-effect transistors (FETs), such as molybdenum disulfide (MoS${_2}$)-FETs, have gained significant attention for their potential for ultra-short channels, thereby extending Moore's law. However, MoS${_2}$-FETs are prone to the formation of Schottky barriers at the metal-MoS${_2}$ interface, resulting in high contact resistance (R${_c}$) and, consequently, reduced transistor currents in the ON-state. Our study explores the modification of MoS${_2}$ to induce the formation of conductive 1T-MoS${_2}$ at the metal-MoS${_2}$ interface via reverse sputtering. MoS${_2}$-FETs exposed to optimized reverse sputtering conditions in the contact area show R${_c}$ values reduced to less than 50% of their untreated counterparts. This reduction translates into improvements in other electrical characteristics, such as higher ON-state currents. Since reverse sputtering is a standard semiconductor process that enhances the electrical performance of MoS${_2}$-FETs, it has great potential for broader application scenarios in 2DM-based microelectronic devices and circuits.