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Main Authors: Zhang, Yifeng, Baker, Bryan, Chen, Shi, Zhang, Chao, Huang, Yu, Zhao, Qi, Bom, Sthitie
Format: Preprint
Published: 2025
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Online Access:https://arxiv.org/abs/2501.03368
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_version_ 1866909449648603136
author Zhang, Yifeng
Baker, Bryan
Chen, Shi
Zhang, Chao
Huang, Yu
Zhao, Qi
Bom, Sthitie
author_facet Zhang, Yifeng
Baker, Bryan
Chen, Shi
Zhang, Chao
Huang, Yu
Zhao, Qi
Bom, Sthitie
contents The growing availability of sensors within semiconductor manufacturing processes makes it feasible to detect defective wafers with data-driven models. Without directly measuring the quality of semiconductor devices, they capture the modalities between diverse sensor readings and can be used to predict key quality indicators (KQI, \textit{e.g.}, roughness, resistance) to detect faulty products, significantly reducing the capital and human cost in maintaining physical metrology steps. Nevertheless, existing models pay little attention to the correlations among different processes for diverse wafer products and commonly struggle with generalizability issues. To enable generic fault detection, in this work, we propose a modular network (MN) trained using time series stage-wise datasets that embodies the structure of the manufacturing process. It decomposes KQI prediction as a combination of stage modules to simulate compositional semiconductor manufacturing, universally enhancing faulty wafer detection among different wafer types and manufacturing processes. Extensive experiments demonstrate the usefulness of our approach, and shed light on how the compositional design provides an interpretable interface for more practical applications.
format Preprint
id arxiv_https___arxiv_org_abs_2501_03368
institution arXiv
publishDate 2025
record_format arxiv
spellingShingle Detecting Defective Wafers Via Modular Networks
Zhang, Yifeng
Baker, Bryan
Chen, Shi
Zhang, Chao
Huang, Yu
Zhao, Qi
Bom, Sthitie
Machine Learning
The growing availability of sensors within semiconductor manufacturing processes makes it feasible to detect defective wafers with data-driven models. Without directly measuring the quality of semiconductor devices, they capture the modalities between diverse sensor readings and can be used to predict key quality indicators (KQI, \textit{e.g.}, roughness, resistance) to detect faulty products, significantly reducing the capital and human cost in maintaining physical metrology steps. Nevertheless, existing models pay little attention to the correlations among different processes for diverse wafer products and commonly struggle with generalizability issues. To enable generic fault detection, in this work, we propose a modular network (MN) trained using time series stage-wise datasets that embodies the structure of the manufacturing process. It decomposes KQI prediction as a combination of stage modules to simulate compositional semiconductor manufacturing, universally enhancing faulty wafer detection among different wafer types and manufacturing processes. Extensive experiments demonstrate the usefulness of our approach, and shed light on how the compositional design provides an interpretable interface for more practical applications.
title Detecting Defective Wafers Via Modular Networks
topic Machine Learning
url https://arxiv.org/abs/2501.03368