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| Main Authors: | , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , |
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| Format: | Preprint |
| Published: |
2025
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| Subjects: | |
| Online Access: | https://arxiv.org/abs/2503.03133 |
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| _version_ | 1866912260315676672 |
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| author | Salami, Richard Poley, Luise Affolder, Kirsten Affolder, Tony Bayer, Lukas Crick, Ben Duden, Emily Dyckes, Ian George Fadeyev, Vitaliy Fortman, Anne Federic, Pavol Franconi, Laura Gignac, Matthew Gupta, Shubham Hallford, John Helling, Cole Hill, Ewan Hu, Miao Kroll, Jiri Kumari, Priyanka Lacasta, Carlos Levagood, Madison Lopez, Hanlez Morelos-Zaragoza, Len Moshe, Meny Raviv Petersen, Aaron Platero, Vicente Rajagopalan, Archa Devi Sitnikova, Lisa Solaz, Carles Soldevila, Urmila Speers, Peter Van Nieuwenhuizen, Gerrit Wang, Alex Zeng |
| author_facet | Salami, Richard Poley, Luise Affolder, Kirsten Affolder, Tony Bayer, Lukas Crick, Ben Duden, Emily Dyckes, Ian George Fadeyev, Vitaliy Fortman, Anne Federic, Pavol Franconi, Laura Gignac, Matthew Gupta, Shubham Hallford, John Helling, Cole Hill, Ewan Hu, Miao Kroll, Jiri Kumari, Priyanka Lacasta, Carlos Levagood, Madison Lopez, Hanlez Morelos-Zaragoza, Len Moshe, Meny Raviv Petersen, Aaron Platero, Vicente Rajagopalan, Archa Devi Sitnikova, Lisa Solaz, Carles Soldevila, Urmila Speers, Peter Van Nieuwenhuizen, Gerrit Wang, Alex Zeng |
| contents | The ATLAS experiment at the Large Hadron Collider (LHC) is currently preparing to replace its present Inner Detector (ID) with the upgraded, all-silicon Inner Tracker (ITk) for its High-Luminosity upgrade (HL-LHC). The ITk will consist of a central pixel tracker and the outer strip tracker, consisting of about 19,000 strip detector modules. Each strip module is assembled from up to two sensors, and up to five flexes (depending on its geometry) in a series of gluing, wirebonding and quality control steps. During detector operation, modules will be cooled down to temperatures of about -35C (corresponding to the temperature of the support structures on which they will be mounted) after being initially assembled and stored at room temperature. In order to ensure compatibility with the detector's operating temperature range, modules are subjected to thermal cycling as part of their quality control process. Ten cycles between -35C and +40C are performed for each module, with full electrical characterisation tests at each high and low temperature point. As part of an investigation into the stress experienced by modules during cooling, it was observed that modules generally showed a change in module shape before and after thermal cycling. This paper presents a summary of the discovery and understanding of the observed changes, connecting them with excess module stress, as well as the resulting modifications to the module thermal cycling procedure. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2503_03133 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | Quality Concerns Caused by Quality Control -- deformation of silicon strip detector modules in thermal cycling tests Salami, Richard Poley, Luise Affolder, Kirsten Affolder, Tony Bayer, Lukas Crick, Ben Duden, Emily Dyckes, Ian George Fadeyev, Vitaliy Fortman, Anne Federic, Pavol Franconi, Laura Gignac, Matthew Gupta, Shubham Hallford, John Helling, Cole Hill, Ewan Hu, Miao Kroll, Jiri Kumari, Priyanka Lacasta, Carlos Levagood, Madison Lopez, Hanlez Morelos-Zaragoza, Len Moshe, Meny Raviv Petersen, Aaron Platero, Vicente Rajagopalan, Archa Devi Sitnikova, Lisa Solaz, Carles Soldevila, Urmila Speers, Peter Van Nieuwenhuizen, Gerrit Wang, Alex Zeng High Energy Physics - Experiment Instrumentation and Detectors The ATLAS experiment at the Large Hadron Collider (LHC) is currently preparing to replace its present Inner Detector (ID) with the upgraded, all-silicon Inner Tracker (ITk) for its High-Luminosity upgrade (HL-LHC). The ITk will consist of a central pixel tracker and the outer strip tracker, consisting of about 19,000 strip detector modules. Each strip module is assembled from up to two sensors, and up to five flexes (depending on its geometry) in a series of gluing, wirebonding and quality control steps. During detector operation, modules will be cooled down to temperatures of about -35C (corresponding to the temperature of the support structures on which they will be mounted) after being initially assembled and stored at room temperature. In order to ensure compatibility with the detector's operating temperature range, modules are subjected to thermal cycling as part of their quality control process. Ten cycles between -35C and +40C are performed for each module, with full electrical characterisation tests at each high and low temperature point. As part of an investigation into the stress experienced by modules during cooling, it was observed that modules generally showed a change in module shape before and after thermal cycling. This paper presents a summary of the discovery and understanding of the observed changes, connecting them with excess module stress, as well as the resulting modifications to the module thermal cycling procedure. |
| title | Quality Concerns Caused by Quality Control -- deformation of silicon strip detector modules in thermal cycling tests |
| topic | High Energy Physics - Experiment Instrumentation and Detectors |
| url | https://arxiv.org/abs/2503.03133 |