APA-Zitierstil (7. Ausg.)

Wang, R., Wang, Z., Lin, T., Raby, J. M., Stan, M. R., & Guo, X. (2025). Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs.

Chicago-Zitierstil (17. Ausg.)

Wang, Runxi, Ziheng Wang, Ting Lin, Jacob M. Raby, Mircea R. Stan, und Xinfei Guo. Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs. 2025.

MLA-Zitierstil (9. Ausg.)

Wang, Runxi, et al. Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs. 2025.