APA (7th ed.) Citation

Bhoumik, P., Bailey, C., & Chakrabarty, K. (2025). Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging.

Chicago Style (17th ed.) Citation

Bhoumik, Partho, Christopher Bailey, and Krishnendu Chakrabarty. Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging. 2025.

MLA (9th ed.) Citation

Bhoumik, Partho, et al. Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging. 2025.