Citazione Stile APA (7a Edizione)

Bhoumik, P., Bailey, C., & Chakrabarty, K. (2025). Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging.

Citazione stile Chigago Style (17a edizione)

Bhoumik, Partho, Christopher Bailey, e Krishnendu Chakrabarty. Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging. 2025.

Citatione MLA (9a ed.)

Bhoumik, Partho, et al. Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging. 2025.