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| Main Authors: | , , |
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| Format: | Preprint |
| Published: |
2025
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| Subjects: | |
| Online Access: | https://arxiv.org/abs/2503.14784 |
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Table of Contents:
- Fan-out wafer-level packaging (FOWLP) addresses the demand for higher interconnect densities by offering reduced form factor, improved signal integrity, and enhanced performance. However, FOWLP faces manufacturing challenges such as coefficient of thermal expansion (CTE) mismatch, warpage, die shift, and post-molding protrusion, causing misalignment and bonding issues during redistribution layer (RDL) buildup. Moreover, the organic nature of the package exposes it to severe thermo-mechanical stresses during fabrication and operation. In order to address these challenges, we propose a comprehensive defect analysis and testing framework for FOWLP interconnects. We use Ansys Q3D to map defects to equivalent electrical circuit models and perform fault simulations to investigate the impacts of these defects on chiplet functionality. Additionally, we present a built-in self-test (BIST) architecture to detect stuck-at and bridging faults while accurately diagnosing the fault type and location. Our simulation results demonstrate the efficacy of the proposed BIST solution and provide critical insights for optimizing design decisions in packages, balancing fault detection and diagnosis with the cost of testability insertion.