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| Format: | Preprint |
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2025
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| Online-Zugang: | https://arxiv.org/abs/2505.03826 |
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| _version_ | 1866910929983111168 |
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| author | Kang, Minji Kim, Seongho Go, Eunseo Paek, Donghyeon Lim, Geon Kim, Muyoung Kim, Soyeun Jang, Sung Kyu Choi, Min Sup Kang, Woo Seok Kim, Jaehyun Kim, Jaekwang Kim, Hyeong-U |
| author_facet | Kang, Minji Kim, Seongho Go, Eunseo Paek, Donghyeon Lim, Geon Kim, Muyoung Kim, Soyeun Jang, Sung Kyu Choi, Min Sup Kang, Woo Seok Kim, Jaehyun Kim, Jaekwang Kim, Hyeong-U |
| contents | Precise monitoring of etch depth and the thickness of insulating materials, such as Silicon dioxide and silicon nitride, is critical to ensuring device performance and yield in semiconductor manufacturing. While conventional ex-situ analysis methods are accurate, they are constrained by time delays and contamination risks. To address these limitations, this study proposes a non-contact, in-situ etch depth prediction framework based on machine learning (ML) techniques. Two scenarios are explored. In the first scenario, an artificial neural network (ANN) is trained to predict average etch depth from process parameters, achieving a significantly lower mean squared error (MSE) compared to a linear baseline model. The approach is then extended to incorporate variability from repeated measurements using a Bayesian Neural Network (BNN) to capture both aleatoric and epistemic uncertainty. Coverage analysis confirms the BNN's capability to provide reliable uncertainty estimates. In the second scenario, we demonstrate the feasibility of using RGB data from digital image colorimetry (DIC) as input for etch depth prediction, achieving strong performance even in the absence of explicit process parameters. These results suggest that the integration of DIC and ML offers a viable, cost-effective alternative for real-time, in-situ, and non-invasive monitoring in plasma etching processes, contributing to enhanced process stability, and manufacturing efficiency. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2505_03826 |
| institution | arXiv |
| publishDate | 2025 |
| record_format | arxiv |
| spellingShingle | In-situ and Non-contact Etch Depth Prediction in Plasma Etching via Machine Learning (ANN & BNN) and Digital Image Colorimetry Kang, Minji Kim, Seongho Go, Eunseo Paek, Donghyeon Lim, Geon Kim, Muyoung Kim, Soyeun Jang, Sung Kyu Choi, Min Sup Kang, Woo Seok Kim, Jaehyun Kim, Jaekwang Kim, Hyeong-U Computer Vision and Pattern Recognition Artificial Intelligence Precise monitoring of etch depth and the thickness of insulating materials, such as Silicon dioxide and silicon nitride, is critical to ensuring device performance and yield in semiconductor manufacturing. While conventional ex-situ analysis methods are accurate, they are constrained by time delays and contamination risks. To address these limitations, this study proposes a non-contact, in-situ etch depth prediction framework based on machine learning (ML) techniques. Two scenarios are explored. In the first scenario, an artificial neural network (ANN) is trained to predict average etch depth from process parameters, achieving a significantly lower mean squared error (MSE) compared to a linear baseline model. The approach is then extended to incorporate variability from repeated measurements using a Bayesian Neural Network (BNN) to capture both aleatoric and epistemic uncertainty. Coverage analysis confirms the BNN's capability to provide reliable uncertainty estimates. In the second scenario, we demonstrate the feasibility of using RGB data from digital image colorimetry (DIC) as input for etch depth prediction, achieving strong performance even in the absence of explicit process parameters. These results suggest that the integration of DIC and ML offers a viable, cost-effective alternative for real-time, in-situ, and non-invasive monitoring in plasma etching processes, contributing to enhanced process stability, and manufacturing efficiency. |
| title | In-situ and Non-contact Etch Depth Prediction in Plasma Etching via Machine Learning (ANN & BNN) and Digital Image Colorimetry |
| topic | Computer Vision and Pattern Recognition Artificial Intelligence |
| url | https://arxiv.org/abs/2505.03826 |