Cita APA (7a ed.)

Wei, Y., Xu, H., Zhang, X., Wang, W., & Cheng, Z. (2026). Ultralow and Tunable Thermal Conductivity of Parylene C for Thermal Insulation in Advanced Packaging.

Cita Chicago Style (17a ed.)

Wei, Yicheng, Han Xu, Xingqiang Zhang, Wei Wang, y Zhe Cheng. Ultralow and Tunable Thermal Conductivity of Parylene C for Thermal Insulation in Advanced Packaging. 2026.

Cita MLA (9a ed.)

Wei, Yicheng, et al. Ultralow and Tunable Thermal Conductivity of Parylene C for Thermal Insulation in Advanced Packaging. 2026.