APA-Zitierstil (7. Ausg.)

Liu, D., Wu, Y., Xiang, H., Li, X., Fu, C., Dong, C., & Zhao, Y. (2026). Bending-like stress induced by solder joint under uniaxial tensile testing in 2G-HTS tapes: Impact and optimization approach.

Chicago-Zitierstil (17. Ausg.)

Liu, Dean, Yue Wu, Haoliang Xiang, Xiaofen Li, Caida Fu, Chiheng Dong, und Yue Zhao. Bending-like Stress Induced by Solder Joint Under Uniaxial Tensile Testing in 2G-HTS Tapes: Impact and Optimization Approach. 2026.

MLA-Zitierstil (9. Ausg.)

Liu, Dean, et al. Bending-like Stress Induced by Solder Joint Under Uniaxial Tensile Testing in 2G-HTS Tapes: Impact and Optimization Approach. 2026.