APA (7th ed.) Citation

Feng, C., Ji, J., Xu, S., Hou, L., Cui, G., Lan, H., . . . Yang, W. (2025). Scalable thermal interface materials with close‐packed structure and high through‐plane thermal conductivity. Wiley. https://doi.org/10.1002/pc.29613

Chicago Style (17th ed.) Citation

Feng, Chang‐Ping, Jin‐Chao Ji, Shao‐Cun Xu, Lei Hou, Gong‐Peng Cui, Hong‐Bo Lan, Fang Wei, Jie Yang, and Wei Yang. Scalable Thermal Interface Materials with Close‐packed Structure and High Through‐plane Thermal Conductivity. Wiley, 2025. https://doi.org/10.1002/pc.29613.

MLA (9th ed.) Citation

Feng, Chang‐Ping, et al. Scalable Thermal Interface Materials with Close‐packed Structure and High Through‐plane Thermal Conductivity. Wiley, 2025. https://doi.org/10.1002/pc.29613.